Ceramic Leadless Chip Carrier Socket

Footprint compatible with cqjb and plcc.

Ceramic leadless chip carrier socket.

Gold or solder dip. Surface mount and soldertail options are available. Variety of body sizes. Socket or surface mount package.

Heat sinks also available in six sizes. Leadless chip carrier sockets. Prototypes and devices intended for extended temperature environments are typically packaged in ceramic while high volume products for consumer and commercial markets are typically packaged in plastic. Solder glass or epoxy seal.

Heat sinks also available in six sizes. 28 44 52 68 84 and 124. The chip is held into the socket by friction. Leadless chip carrier sockets conform to jedec standards a b c and d.

The lcc package is preferred where requirements call out for a low profile package or a surface mountable solderable package with low inductance to be used in. Kyocera s multilayer division utilizes the most state of the art equipment combined with a knowledgeable technical staff to create high quality durable leadless chip carriers lcc. Leadless chip carrier sockets conform to jedec standards a b c and d. Ceramic leadless chip carrier lcc national does not assume any responsibility for use of any circuitry described no circuit patent licenses are implied and national reserves the right at any time without notice to change said circuitry and specifications.

Stainless steel spring latch is available in a variety of thicknesses to facilitate proper contact. 28 44 52 68 84 and 124. Generally speaking sockets for plcc chips j lead are not compatible with leadless chip carriers since their contacts are typically recessed between fingers that align and grip the plcc package itself. Surface mount and soldertail options are available.

Stainless steel spring latch is available in a variety of thicknesses to facilitate proper contact force with the socket. Prototypes and devices intended for extended temperature environments are typically packaged in ceramic while high volume products for consumer and commercial markets are typically packaged in plastic. A socket for a leadless chip carrier said socket including a base member having a central opening therein a plurality of conductive resilient contacts for engaging conductive pads on said carrier each contact anchored in said base member and including an upwardly extending part said contacts positioned on at least two side edges of said base member opening and constituting opposing. Castellations instead external leads.

Low profile multilayer ceramic package. Contact is primarily made on the sides of the package not the bottom in order to take advantage of the wiping action. Leadless chip carriers are ideal for surface mount applications. A plastic leaded chip carrier plcc has a rectangular plastic housing it is a reduced cost evolution of the ceramic leadless chip carrier clcc.