Ceramic Bga Reliability

The cookies we use can be categorized as follows.

Ceramic bga reliability.

In addition to alumina al 2 o 3 ceramics we produce aluminum nitride aln with high thermal conductivity 150w mk as well as low temperature co fired ceramic ltcc packages with high 12 3ppm k and low 3. Large number of vias within area of bga increases cte locally. Typically these are packaged in organic or ceramic ball grid array bga packages which cover a wide range of package input output i o capabilities required for high performance devices. Lower cte may be used to increase reliability.

Ceramic ball grid array package drawings bg accept and proceed. Bga package component reliability after long term storage r. Ball grid array bga assembly reliability jpl nepp presentation ipc 9701 csp thermal cycle created date. Balls for this package are 90 pb and 10 sn and attached to the ceramic substrate using eutectic 63sn 37pb solder paste.

Substrate based ball grid array bga flip chip bga quad flat leadless stacked chip scale flip chip csp xuejun fan moisture related reliability xuejun fan lamar edu higher performance smaller size cheaper price chip scale and wafer level packaging csp wlp. Ceramic plates and printed circuit boards pcb to assess solder wetting. Also utilized was a 256 leaded and a 256 plastic bga package for evaluating and directly comparing manufacturing robustness and reliability. Ceramic ball grid array packaging assembly reliability freescale semiconductor.

Type 2 ceramic and plastic bga packages with nearly 600 i os. Flip chip hitce ltcc bga package kyocera provides both ceramic and organic packages for large scale integration lsi devices. In addition the utilized ceramic ball grid array cbga. Flip chip cbga is a common package for high end microprocessor devices.

A small tape based plastic bga package with 280 balls was included in the study 16 x 16 mm 0 8 mm pitch 9 x 9 depopulated center. Plastic bga pbga ceramic bga cbga pwb 63sn 37pb eutectic flip chip flip chip bga fcbga column cbga ccga 90pb 10sn high melt i o 600 i o 600. Shih et al reliability of hitce ceramic bga packages to be published 2005. Assemblies with water soluble flux were cleaned in an electrovert h500.